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セガワ ノリヒサ
SEGAWA NORIHISA
瀬川 典久 所属 京都産業大学 情報理工学部 情報理工学科 職種 教授 |
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| 言語種別 | 英語 |
| 発行・発表の年月 | 2019 |
| 形態種別 | 研究論文（国際会議プロシーディングス） |
| 査読 | 査読あり |
| 標題 | Hot Stamping of Electric Circuits by 3D Printer |
| 執筆形態 | その他 |
| 掲載誌名 | ADJUNCT PUBLICATION OF THE 32ND ANNUAL ACM SYMPOSIUM ON USER INTERFACE SOFTWARE AND TECHNOLOGY (UIST'19 ADJUNCT) |
| 出版社・発行元 | ASSOC COMPUTING MACHINERY |
| 巻・号・頁 | pp.128-130 |
| 著者・共著者 | Yuhei Imai,Kunihiro Kato,Norihisa Segawa,Hiroyuki Manabe |
| 概要 | Making modern electric circuits involves a lot of processes, skills, and effort. One challenge in fabricating prototypes is the difficulty of making electric circuits. We propose a fabrication technique that allows users to easily build electric circuits. It is based on a hot stamping technique but uses a single extruder 3D printer instead of dies. The circuits are made of metal foil and can be deposited on various surfaces including paper and acrylic board. Tests confirm that the technique can fabricate circuits on which electronic devices can be implemented by soldering. |
| DOI | 10.1145/3332167.3356895 |
| DBLP ID | conf/uist/ImaiKSM19 |
| PermalinkURL | https://dblp.uni-trier.de/rec/conf/uist/2019a |
| researchmap用URL | https://dblp.uni-trier.de/db/conf/uist/uist2019a.html#ImaiKSM19 |